TSMC showed off its forthcoming A16 process technology node, targeted for the second half of 2026, at its 30th North American ...

U.S. workforce hubs; Samsung's V-NAND chip; TSMC's A16 process and SoW; NVIDIA's AI acquisitions; IBM to acquire HashiCorp; China/Japan AI EV partnerships; MIT's secure digital IMC chip; a foundry ...

This is where a shift-left strategy comes in. Analysis of the multiphysics effects of 3D-ICs (thermal, mechanical, etc.) in ...

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and ...

How neural network-based AI systems perform under the hood is currently unknown, but the industry is finding ways to live ...

By 2030, 6G is expected to be commercially available, revolutionizing connectivity with lightning-fast speeds, unprecedented ...

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always ...

Of particular concern is electromigration, which is becoming more troublesome in advanced packages with multiple chiplets, ...

Alongside the high parallelism and high connectivity of wave optics, the chiplet explores a general and iterative ...

There are two commonalities in all perspectives. Clearly, the flat, fully distributed architectures are a thing of the past. And all perspectives eventually arrive at some form of fully centralized ...

Cadence’s Vatsal Patel notes the factors that make high-bandwidth memory ideal for AI, such as improved bandwidth and area from vertical stacking and power reduction features like data bus inversion.

Multi-beam mask writers and curvilinear design stand out as key achievements.