The CHIPS for America Program will allot about $285 million for the institute that will focus on development, validation and use of digital twins for chip manufacturing, advanced packaging, assembly ...

Leveraging standards-based SCPS protocol acceleration, link bonding, Layer 2 switching and Layer 3 routing, XipLink delivers intelligent multi-orbit networking that ensures network performance and QoS ...

Empower Semiconductor has unveiled the largest silicon capacitor in its ECAP product family for high frequency decoupling. The new EC1005P is a single 16.6-microfarad (μF) capacitance device suitable ...

Keysight Technologies, Inc. has announced industry-first testing capabilities designed to test the robustness of post-quantum ...

Rogue Valley claims it will be the first pure-play MEMS foundry with a 300 mm wafer capability. The fab is designed for ...

Hyundai Motor Group will keep its autonomous vehicle joint venture Motional alive with a direct investment of $475 million.

Rambus Inc. has introduced a family of DDR5 server power management ICs (PMICs) that will enable a complete memory interface ...

The key wireless technologies at play are Wi-Fi 5/6, 5G, and yes, even Bluetooth. All can play a key role in lowering latency ...

SkyWater Technology and Lumotive have started production on what they claim is the world’s first programmable optical metasurface that has been commercialized into a mass-producible chip.

Pleora Technologies is expanding its eBUS Edge GigE Vision software transmitter solution with feature-based licensing tiers ...

Memory semiconductor vendor Micron Technology Inc. has started shipments of its 32 Gb DRAM die-based 128 GB DDR5 RDIMM memory targeted for artificial intelligence (AI) data centers.

Rohde & Schwarz has teamed up with IPG Automotive, a pioneer in virtual test driving, to redefine automotive radar Hardware-in-the-Loop (HIL) integration testing and thereby reducing the cost by ...